LOCTITE® ABLESTIK 8700K
Features and Benefits
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE® ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
- Non-conductive
- Excellent adhesion
- For thin & thick film gold surfaces
- Heat cure
- Non-slump
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 20.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 55.0 ppm/°C |
| Color | White |
| Cure schedule, @ 175.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 165.0 °C |
| RT die shear strength, 2 x 2 mm on Gold | 5000.0 kg-f |
| Thermal conductivity | 0.5 W/mK |
| Viscosity, @ 25.0 °C | 45000.0 mPa·s (cP) |
| Volume resistivity | 3x10¹⁴ Ohm cm |
LOCTITE® ABLESTIK 8700K
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.