LOCTITE® ABLESTIK ABP 2035SCR
功能与优点
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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技术信息
| 固化方式 | 热+紫外线 |
| 导热性 | 0.4 W/mK |
| 应用 | 芯片焊接 |
| 热膨胀系数 (CTE) | 50.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 135.0 ppm/°C |
| 玻璃化温度 (Tg) | 118.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa.s (cP) |
| 触变指数 | 4.0 |
LOCTITE® ABLESTIK ABP 2035SCR
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive