LOCTITE® ABLESTIK ABP 2035SCR
Features and Benefits
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 50.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 135.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 118.0 °C |
| Thermal conductivity | 0.4 W/mK |
| Thixotropic index | 4.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2035SCR
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive