LOCTITE® ABLESTIK ABP 2035SCR
Vlastnosti a výhody
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Koeficient tepelnej rozťažnosti (CTE) | 50.0 ppm/°C |
| Koeficient tepelnej rozťažnosti (CTE), Above Tg | 135.0 ppm/°C |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Tepelná vodivosť | 0.4 W/mK |
| Teplota priepustnosti skla (Tg) | 118.0 °C |
| Tixotropný index | 4.0 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2035SCR
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive