BERGQUIST® GAP PAD® TGP HC5000
Poznano kot Gap Pad® HC 5.0
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This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.
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| Delovna temperatura | -60.0 - 200.0 °C |
| Ocena plamena | V-0 |
| Toplotna prevodnost | 5.0 W/mK |
| Vrsta nosilca | Steklena vlakna |
| Youngovi moduli, ASTM D575 | 121.0 KPa (17.5 psi ) |
BERGQUIST® GAP PAD® TGP HC5000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.