BERGQUIST® GAP PAD® TGP HC5000
Conhecido como Gap Pad® HC 5.0
Características e Benefícios
slide 1 of 1
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.
Ler mais
Documentos e Downloads
Procurando por um TDS ou MSDS / FISPQ em outro idioma?
Documentação Adicional
Informação Técnica
Classificação da chama | V-0 |
Condutividade térmica | 5.0 W/mK |
Módulo de Young, ASTM D575 | 121.0 KPa (17.5 psi ) |
Temperatura de operação | -60.0 - 200.0 °C |
Tipo de operadora | Fibra de Vidro |