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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Part no. (SKU/IDH):
2195379

IDH Name:
BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ dimension, 0.080″ thickness

Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP HC5000

Soft, fiberglass-reinforced insulation pad - high-performance

This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.

Marketing materials

Part no. (SKU/IDH):
2195379

IDH Name:
BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ dimension, 0.080″ thickness

Part no. (SKU/IDH) 2195379
BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ dimension, 0.080″ thickness

Thickness Please make your selection 0.080″

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.

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