BERGQUIST® GAP PAD® TGP HC5000
Known as Gap Pad® HC 5.0
Features and Benefits
Available sizes:
Thermally conductive, silicone-based, fiberglass-reinforced GAP PAD filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- Silicone-based
- Fiberglass-reinforced for shear and tear resistance
- Thermal conductivity: 5 W/m-K (ASTM D5470)
- High compliance, low compression stress
Documents and Downloads
Safety Data Sheets and RoHs
- 8 in x 16 in x 0.100 in Sheet - IDH 2168237
- 8 in x 16 in x 0.020 in Sheet - IDH 2195376
- 8 in x 16 in x 0.040 in Sheet - IDH 2195377
BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ dimension, 0.100″ thickness 2168237 en-KR
IDH:
2168237
Size Case: 8 in x 16 in x 0.100 in Sheet
BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ dimension, 0.020″ thickness 2195376 en-KR
IDH:
2195376
Size Case: 8 in x 16 in x 0.020 in Sheet
BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ dimension, 0.040″ thickness 2195377 en-KR
IDH:
2195377
Size Case: 8 in x 16 in x 0.040 in Sheet
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Additional Documents
Technical Information
Carrier type | Fiberglass |
Flame rating | V-0 |
Operating temperature | -60.0 - 200.0 °C |
Thermal conductivity | 5.0 W/mK |
Young's modulus, ASTM D575 | 121.0 KPa (17.5 psi ) |