LOCTITE® 3621

Poznano kot Chipbonder 3621

Lastnosti in prednosti

Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Tehnične informacije

Fizična oblika Gel
Koeficient toplotnega raztezanja (CTE), Above Tg 100.0 ppm/°C
Meja plastičnosti, Stožec in plošča, Haake PK100, M10/PK1, 2°, @ 25.0 °C 130.0 - 280.0 Pa∙s
Način strjevanja Strjevanje na podlagi toplote
Strižna trdnost, Jeklo (peskano) 2175.0 psi
Temperatura skladiščenja 2.0 - 8.0 °C
Urnik strjevanja, @ 150.0 °C 90.0 - 120.0 sek.
Viskoznost po Cassonu, stožec in plošča Haake PK100, M10/PK1, 2°, @ 25.0 °C 0.5 - 3.0 Pa∙s
Število komponent 1 Del