LOCTITE® 3621
Known as Chipbonder 3621
Features and Benefits
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
LOCTITE® 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Technical Information
| Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Cure schedule, @ 150.0 °C | 90.0 - 120.0 sec. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Gel |
| Shear strength, Steel (grit blasted) | 2175.0 psi |
| Storage temperature | 2.0 - 8.0 °C |
| Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
LOCTITE® 3621
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.