LOCTITE® 3621

Known as Chipbonder 3621

Features and Benefits

This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
LOCTITE® 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Technical Information

Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C 0.5 - 3.0 Pa∙s
Coefficient of thermal expansion (CTE), Above Tg 100.0 ppm/°C
Cure schedule, @ 150.0 °C 90.0 - 120.0 sec.
Cure type Heat cure
Number of components 1 part
Physical form Gel
Shear strength, Steel (grit blasted) 2175.0 psi
Storage temperature 2.0 - 8.0 °C
Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C 130.0 - 280.0 Pa∙s