LOCTITE® 3621

Conhecido como Chipbonder 3621

Características e Benefícios

Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Informação Técnica

Casson viscosidade, cone & placa Haake PK100, M10/PK1, 2°, @ 25.0 °C 0.5 - 3.0 Pa∙s
Coeficiente de expansão térmica (CTE), Above Tg 100.0 ppm/°C
Cronograma de cura, @ 150.0 °C 90.0 - 120.0 seg.
Forma física Gel
Força de cisalhamento, Aço (jateado) 2175.0 psi
Limite de escoamento, cone e placa, Haake PK100, M10/PK1, 2°, @ 25.0 °C 130.0 - 280.0 Pa∙s
Número de componentes Monocomponente
Temperatura de armazenamento 2.0 - 8.0 °C
Tipo de cura Cura por Calor