LOCTITE® 3621
Known as Chipbonder 3621
Features and Benefits
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Technical Information
| Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Cure schedule, @ 150.0 °C | 90.0 - 120.0 sec. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Gel |
| Shear strength, Steel (grit blasted) | 2175.0 psi |
| Storage temperature | 2.0 - 8.0 °C |
| Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
LOCTITE® 3621
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.