LOCTITE® 3621
被稱為 Chipbonder 3621
功能與優點
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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技術資訊
| 儲存溫度 | 2.0 - 8.0 °C |
| 剪切強度, 鋼（噴砂） | 2175.0 psi |
| 卡森粘度，錐型和板型，Haake PK100、M10/PK1，2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| 固化類型 | 熱固化 |
| 屈服點、錐板、Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
| 建議固化方式, @ 150.0 °C | 90.0 - 120.0 秒 |
| 熱膨脹係數 (CTE), Above Tg | 100.0 ppm/°C |
| 物理形態 | 凝膠 |
| 零組件數 | 1 組分 |
LOCTITE® 3621
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.