LOCTITE® ABLESTIK 566K
Known as Ablestik ABLEFILM 566K
Features and Benefits
LOCTITE ABLESTIK 566K, Epoxy Film, Assembly
LOCTITE® ABLESTIK 566K is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. This material is a low temperature cure version of LOCTITE ABLESTIK 561K adhesive.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Cure schedule, @ 100.0 °C | 3.0 hr. |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 6.1 |
| Glass transition temperature (Tg) | 93.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 2200.0 psi |
| Thermal conductivity | 0.8 W/mK |
LOCTITE® ABLESTIK 566K
LOCTITE ABLESTIK 566K, Epoxy Film, Assembly