LOCTITE® ABLESTIK 8200TI
功能与优点
LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
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技术信息
| 固化方式 | 热+紫外线 |
| 固化时间, @ 175.0 °C 30 min. ramp | 45.0 分钟 |
| 应用 | 芯片焊接 |
| 热模剪切强度 | 6.0 kg-f |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 8800.0 mPa.s (cP) |
| 触变指数 | 5.0 |
| 颜色 | 银 |
LOCTITE® ABLESTIK 8200TI
LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive