LOCTITE® ABLESTIK 8200TI

Features and Benefits

LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
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Technical Information

Applications Die attach
Colour Silver
Cure schedule, @ 175.0 °C 30 min. ramp 45.0 min.
Cure type Heat cure
Hot die shear strength 6.0 kg-f
Thixotropic index 5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 8800.0 mPa·s (cP)