LOCTITE® ABLESTIK 8200TI
Features and Benefits
LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
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Technical Information
| Applications | Die attach |
| Colour | Silver |
| Cure schedule, @ 175.0 °C 30 min. ramp | 45.0 min. |
| Cure type | Heat cure |
| Hot die shear strength | 6.0 kg-f |
| Thixotropic index | 5.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 8800.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8200TI
LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive