LOCTITE® ABLESTIK ABP 2040LV
Elementi i pogodnosti
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2040LV non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and decrease warpage between dissimilar surfaces.
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Dokumenti i preuzimanja
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Tehnički podaci
| Koeficijent toplotnog širenja (CTE) | 39.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Above Tg | 129.0 ppm/°C |
| Primene | Dodavanje boje |
| Temperatura razmekšavanja (Tg) | 28.0 °C |
| Tiksotropni indeks | 5.1 |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Toplotna provodljivost | 0.4 W/mK |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2040LV
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive