LOCTITE® ABLESTIK ABP 2040LV
特長および利点
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2040LV non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and decrease warpage between dissimilar surfaces.
詳細はこちら
技術情報
| アプリケーション(用途) | ダイ接着剤 |
| ガラス転移温度 (Tg) | 28.0 °C |
| チクソ性指数 | 5.1 |
| 熱伝導率 | 0.4 W/mK |
| 熱膨張率 | 39.0 ppm/°C |
| 熱膨張率, Above Tg | 129.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 粘度、ブルックフィールド CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2040LV
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive