LOCTITE® ABLESTIK ABP 2040LV
Features and Benefits
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2040LV non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and decrease warpage between dissimilar surfaces.
- Non-conductive
- Single component
- Fast cure
- Low temperature cure
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 39.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 129.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 28.0 °C |
| Thermal conductivity | 0.4 W/mK |
| Thixotropic index | 5.1 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2040LV
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive