LOCTITE® ABLESTIK ABP 2040LV
Omadused ja eelised
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2040LV non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and decrease warpage between dissimilar surfaces.
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Tehniline teave
| Klaasistumistemperatuur (Tg) | 28.0 °C |
| Rakendused | Stantskinnitus |
| Soojusjuhtivus | 0.4 W/mK |
| Soojuspaisumise koefitsient (CTE) | 39.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 129.0 ppm/°C |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 5.1 |
| Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2040LV
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive