LOCTITE® ECCOBOND UF 3513HF
Features and Benefits
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 197.7 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 60.4 ppm/°C |
| Cure schedule, @ 80.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 75.0 °C |
| Pot life | 3.0 day |
| Storage temperature | 2.0 - 8.0 °C |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 3300.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 3513HF
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant