LOCTITE® ECCOBOND UF 3513HF
Omadused ja eelised
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.
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Tehniline teave
| Kasutusaeg | 3.0 päev |
| Klaasistumistemperatuur (Tg) | 75.0 °C |
| Kõvenemisaeg, @ 80.0 °C | 30.0 minut |
| Soojuspaisumise koefitsient (CTE), Above Tg | 197.7 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Below Tg | 60.4 ppm/°C |
| Säilitustemperatuur | 2.0 - 8.0 °C |
| Tahkumistüüp | Kuumkõvenemine |
| Viskoossus, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 3300.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3513HF
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant