BERGQUIST® GAP PAD® TGP HC5000

Known as Gap Pad® HC 5.0

Features and Benefits

This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.
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Technical Information

Carrier type Fiberglass
Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Thermal conductivity 5.0 W/mK
Young's modulus, ASTM D575 121.0 KPa (17.5 psi )