LOCTITE® ECCOBOND FP4451

Features and Benefits

LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam
LOCTITE® ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. Please refer to the TDS for alternate cure schedules.
Read More

Documents and Downloads

There are no documents and downloads available for your location and language. You can try searching for a document in another language

Search for TDS in another language
Search for SDS in another language

Technical Information

Coefficient of thermal expansion (CTE), Below Tg 22.0 ppm/°C
Color Black
Cure schedule, Alternate @ 165.0 °C 90.0 min.
Cure schedule, Recommended @ 125.0 °C 30.0 min.
Cure type Heat cure
Filler 71.0 %
Glass transition temperature (Tg) 155.0 °C
Operating temperature -65.0 - 150.0 °C
Specific gravity, @ 25.0 °C 1.76
Storage temperature -40.0 °C
Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 4 rpm 860000.0 mPa·s (cP)