LOCTITE® ECCOBOND FP4451
Features and Benefits
LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam
LOCTITE® ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. Please refer to the TDS for alternate cure schedules.
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Technical Information
| Coefficient of thermal expansion (CTE), Below Tg | 22.0 ppm/°C |
| Colour | Black |
| Cure schedule, Alternate @ 165.0 °C | 90.0 min. |
| Cure schedule, Recommended @ 125.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Filler | 71.0 % |
| Glass transition temperature (Tg) | 155.0 °C |
| Operating temperature | -65.0 - 150.0 °C |
| Specific gravity, @ 25.0 °C | 1.76 |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 4 rpm | 860000.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4451
LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam