LOCTITE® ECCOBOND FP4451

Features and Benefits

LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam
LOCTITE® ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. Please refer to the TDS for alternate cure schedules.
  • High purity
  • Green product
  • Minimal slumping
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Technical Information

Coefficient of thermal expansion (CTE), Below Tg 22.0 ppm/°C
Color Black
Cure schedule, Alternate @ 165.0 °C 90.0 min.
Cure schedule, Recommended @ 125.0 °C 30.0 min.
Cure type Heat cure
Filler 71.0 %
Glass transition temperature (Tg) 155.0 °C
Operating temperature -65.0 - 150.0 °C
Specific gravity, @ 25.0 °C 1.76
Storage temperature -40.0 °C
Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 4 rpm 860000.0 mPa·s (cP)