LOCTITE® ECCOBOND FP4451
Características y Ventajas
LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam
LOCTITE® ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. Please refer to the TDS for alternate cure schedules.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Below Tg | 22.0 ppm/°C |
| Color | Negro |
| Gravedad específica, @ 25.0 °C | 1.76 |
| Programa de curado, Alternativo @ 165.0 °C | 90.0 min |
| Programa de curado, Recomendado @ 125.0 °C | 30.0 min |
| Relleno | 71.0 % |
| Temperatura de almacenamiento | -40.0 °C |
| Temperatura de funcionamiento | -65.0 - 150.0 °C |
| Temperatura de transición vítrea (Tg) | 155.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 4 rpm | 860000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4451
LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam