LOCTITE® ABLESTIK QMI529HT
Features and Benefits
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
- Compatible with many metal substrates
- High resistance to heat and humidity
- Hydrophobic
- Void-free bond line
- High resistance to delamination
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 53.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Fluoride (F-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 20.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Hot die shear strength, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe | 21.0 kg-f |
| Key characteristics | Conductivity: electrically conductive, Conductivity: thermally conductive |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 7.62 x 7.62 mm die on Ag/Cu leadframe | 57.0 kg-f |
| Recommended for use with | LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, @ 25.0 °C | 3300.0 N/mm² (478500.0 psi ) |
| Thixotropic index | 4.8 |
LOCTITE® ABLESTIK QMI529HT
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.