LOCTITE® ABLESTIK QMI529HT
Features and Benefits
LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach
LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
- Electrically conductive
- Thermally conductive
- Void-free bondline
- Hydrophobic
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 53.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Fluoride (F-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 20.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Hot die shear strength, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe | 21.0 kg-f |
| Key characteristics | Conductivity: electrically conductive, Conductivity: thermally conductive |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 7.62 x 7.62 mm die on Ag/Cu leadframe | 57.0 kg-f |
| Recommended for use with | LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, @ 25.0 °C | 3300.0 N/mm² (478500.0 psi ) |
| Thixotropic index | 4.8 |
LOCTITE® ABLESTIK QMI529HT
LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach