LOCTITE® ABLESTIK QMI529HT
Značajke i prednosti
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
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Dokumenti i preuzimanja
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Tehnički podaci
| Broj komponenti | 1 dio |
| Fizički oblik | Pasta |
| Izvlačivi jonski sadržaj, Fluorid (F-) | 20.0 ppm |
| Izvlačivi jonski sadržaj, Kalij (K+) | 20.0 ppm |
| Izvlačivi jonski sadržaj, Klorid (CI-) | 20.0 ppm |
| Izvlačivi jonski sadržaj, Natrij (Na+) | 20.0 ppm |
| Ključne karakteristike | Vodljivost: Provodi toplinu, Vodljivost: električno vodljivo |
| Koeficijent toplinske ekspanzije (CTE) | 53.0 ppm/°C |
| Preporučuje se za upotrebu s | Glavni okvir: Srebro, Glavni okvir: Zlato |
| Primjene | Ukalupljeno |
| Snaga smicanja u kalupu RT, 7.62 x 7.62 mm die on Ag/Cu leadframe | 57.0 kg-f |
| Snaga smicanja u vrućem kalupu, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe | 21.0 kg-f |
| Tiksotropni indeks | 4.8 |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Vlačni modul, @ 25.0 °C | 3300.0 N/mm² (478500.0 psi ) |
LOCTITE® ABLESTIK QMI529HT
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.