BERGQUIST® GAP PAD® TGP HC5000
Known as Gap Pad® HC 5.0
Features and Benefits
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This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces, allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides, which reduces the need for additional bulky adhesive layers. It comes with protective liners on both side for easy handling.
- Silicone-based
- Fiberglass-reinforced for shear and tear resistance
- Thermal conductivity: 5 W/m-K (ASTM D5470)
- High compliance, low compression stress
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 5.0 W/mK |
| Young's modulus, ASTM D575 | 121.0 KPa (17.5 psi ) |
BERGQUIST® GAP PAD® TGP HC5000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.