LOCTITE® 3517M

Merkmale und Vorteile

One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M™ is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M™ is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Technische Informationen

Aushärtezyklus, Empfohlen @ 120.0 °C 5.0 Min.
Aushärtungsplan Lichtintensität 30.0 mW/cm²
Glasübergangstemperatur (Tg) 78.0 °C
Viskosität, Haake PK1.2 2600.0 mPa.s (cP)
Wärmeausdehnungskoeffizient (CTE) 65.0 ppm/°C
Wärmeausdehnungskoeffizient (CTE), Above Tg 191.0 ppm/°C