LOCTITE® 3517M
Elementi i pogodnosti
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Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
LOCTITE® 3517M is a reliable, black liquid, epoxy-based underfill solution designed for the production of BGA and CSP. It's ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Tehnički podaci
| Intenzitet rasporeda svetlosne polimerizacije | 30.0 mW/cm² |
| Koeficijent toplotnog širenja (CTE) | 65.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Above Tg | 191.0 ppm/°C |
| Raspored polimerizacije, Preporučeno @ 120.0 °C | 5.0 minuta |
| Temperatura razmekšavanja (Tg) | 78.0 °C |
| Viskoznost, Haake PK1.2 | 2600.0 mPa.s (cP) |
LOCTITE® 3517M
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).