LOCTITE® 3517M
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Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
LOCTITE® 3517M is a reliable, black liquid, epoxy-based underfill solution designed for the production of BGA and CSP. It's ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Tehniline teave
| Klaasistumistemperatuur (Tg) | 78.0 °C |
| Kõvenemisaeg, Soovitatav @ 120.0 °C | 5.0 minut |
| Kõvenemisaega valgusintensiivsus | 30.0 mW/cm² |
| Soojuspaisumise koefitsient (CTE) | 65.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 191.0 ppm/°C |
| Viskoossus, Haake PK1.2 | 2600.0 mPa.s (cP) |
LOCTITE® 3517M
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).