LOCTITE® 3517M

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One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M™ is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M™ is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Technische informatie

Coëfficiënt van thermische uitzetting (CTE) 65.0 ppm/°C
Coëfficiënt van thermische uitzetting (CTE), Above Tg 191.0 ppm/°C
Glasovergangstemperatuur (Tg) 78.0 °C
Uithardingsschema lichtintensiteit 30.0 mW/cm²
Uithardingsschema, Aanbevolen @ 120.0 °C 5.0 min.
Viscositeit, Haake PK1.2 2600.0 mPa.s (cP)