LOCTITE® 3517M
Características y Ventajas
One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Información técnica
| Coeficiente de dilatación térmica (CDT) | 65.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 191.0 ppm/°C |
| Programa de curado, Recomendado @ 120.0 °C | 5.0 min |
| Programa de intensidad de luz de curado | 30.0 mW/cm² |
| Temperatura de transición vítrea (Tg) | 78.0 °C |
| Viscosidad, Haake PK1.2 | 2600.0 mPa.s (cP) |
LOCTITE® 3517M
One-part, reworkable epoxy underfill for CSP and BGA production.