LOCTITE® ABLESTIK 8290

被称为 ABLEBOND 8290 (38G)

功能与优点

This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability lead frame packaging applications.
LOCTITE® ABLESTIK 8290 is a silver, electrically conductive die-attach adhesive for high-reliability leadframe packaging applications, recommended for die sizes up to 200 mils for the best MRT performance. It’s formulated with an epoxy-based resin, cures when exposed to heat and demonstrates low stress and low bleed.
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技术信息

RT 模剪切强度 15.0 kg-f
可萃取出的离子含量, 氯化物 (CI-) 29.0 ppm
可萃取出的离子含量, 钠 (Na+) 19.0 ppm
可萃取出的离子含量, 钾 (K+) 19.0 ppm
固化方式 热+紫外线
应用 芯片焊接
拉伸模量, @ 250.0 °C 117.0 N/mm² (17000.0 psi )
热膨胀系数 (CTE) 81.0 ppm/°C