LOCTITE® ABLESTIK 8290
Features and Benefits
This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability lead frame packaging applications.
LOCTITE® ABLESTIK 8290 is a silver, electrically conductive die-attach adhesive for high-reliability leadframe packaging applications, recommended for die sizes up to 200 mils for the best MRT performance. It’s formulated with an epoxy-based resin, cures when exposed to heat and demonstrates low stress and low bleed.
- Improved JEDEC performance
- Low stress and low bleed
Documents and Downloads
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Additional Documents
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 81.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 29.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| RT die shear strength | 15.0 kg-f |
| Tensile modulus, @ 250.0 °C | 117.0 N/mm² (17000.0 psi ) |
LOCTITE® ABLESTIK 8290
This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability lead frame packaging applications.