LOCTITE® ABLESTIK 8290

Known as ABLEBOND 8290 (38G)

Features and Benefits

This silver, electrically-conductive die attach adhesive is specially designed for high reliability leadframe packaging applications.
LOCTITE® ABLESTIK 8290 electrically-conductive die attach adhesive is specifically designed for high reliability leadframe packaging applications. It is recommended for die sizes <200 mils for the best MRT performance, and is low stress and low bleed.
  • Low stress
  • Low bleed
  • Improved JEDEC performance
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 81.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 29.0 ppm
Extractable ionic content, Potassium (K+) 19.0 ppm
Extractable ionic content, Sodium (Na+) 19.0 ppm
RT die shear strength 15.0 kg-f
Tensile modulus, @ 250.0 °C 117.0 N/mm² (17000.0 psi )