Discover our solutions addressing the dynamic trends in automotive electronics - from autonomous driving, connectivity, electrification to enhanced comfort and safety. Our advanced materials combat heat generation in high-power components, ensure seamless connectivity, and adhere to stringent road safety and environmental standards. With a focus on reliability, sustainability and process efficiency, we offer comprehensive solutions for thermal management, bonding & connecting, protecting & sealing. Our process expertise and equipment, including state-of-the-art mixing and dispensing machines, supports high-speed, efficient production. Partner with Henkel to navigate the complexities of automotive electronics with innovative, tailored solutions.
by 2030
Size of global automotive electronics market.
*Source: McKinsey & Company "Outlook on the automotive software and electronics market through 2030".
have ADAS
ADAS are available on more than 50% of 2023 model-year vehicles.
*Source: Consumer Reports "Ford’s BlueCruise Remains CR’s Top-Rated Active Driving Assistance System" 2023.
chips/vehicle
The average number of semiconductor chips per car. Some have 3,000 chips.
*Source: DRex 2023 "How Many Semiconductor Chips in a Modern Car?".
Electronics enable vehicle sophistication. From ADAS to automotive displays, camera lens bonding and lens alignment, and electronic control units, advanced materials such as adhesives and innovative technologies, are boosting the performance and reliability of automotive electronics.
- ADAS Camera
- ADAS Radar
- ADAS Lidar
- ADAS Control Module
- ADAS V2X
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
Threadlockers lock and seal your threaded assemblies, protecting against vibration, corrosion, and galling. But depending on your need, you have to choose the right threadlocker and consider strength, form, and removability. Which one will you need? LOCTITE® makes your choice easy.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe, and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today‘s challenging, high-density die architectures.
Achieve optical active alignment with advanced dual-cure or 1 step cure adhesives designed for reliable functionality in ADAS camera and lidar modules.
At every level of camera construction - from the active alignment adhesives, image processor die attach to component connection, thermal management, underfill materials and structural bonding of the final module assembly - Henkel's automotive camera solutions are the comprehensive, enabling superior functionality and reliability.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe, and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Improve reliability with lead-free solder alternatives ideal for SMT components, thermal, structural bonding, and EMI applications.
Thermal interface materials, gaskets, and coatings with an electromagnetic absorption or shielding feature.
Ensuring radar systems continue to function correctly depends largely on the integrity of the components in the units themselves and how they are mounted to the vehicle. Additionally, as these particular components continue to become smaller, efficient heat dissipation and thermal protection is crucial to long term functionality. Those functions will be strengthen through Liquid Gasket Solutions, underfill and Thermal Interface Materials.
Achieve optical active alignment with advanced dual-cure or 1-step cure adhesives designed for reliable functionality in ADAS camera and lidar modules.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today‘s challenging, high-density die architectures.
Provide tough, durable bonds to a wide variety of surfaces in engineering applications.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe, and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
LiDAR (Light Imaging, Detection, and Ranging) systems provide a very fast and high-definition topography of the environment using Laser with the additional advantage - the calculation of distances between vehicles and other objects sensors. For this specific technology Henkel provides the material solutions to assemble these sensors, including lens bonding materials, die attach, underfill and Thermal Interface Materials.
Threadlockers lock and seal your threaded assemblies, protecting against vibration, corrosion, and galling. But depending on your need, you have to choose the right threadlocker and consider strength, form, and removability. Which one will you need? LOCTITE® makes your choice easy.
Thermal interface materials, gaskets, and coatings with an electromagnetic absorption or shielding feature.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals, and extreme temperature variations.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe, and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today‘s challenging, high-density die architectures.
At the heart of any ADAS car or autonomous vehicle, the data module combines the information received from the various sensors, processing a wealth of data generated by the ADAS sensors. Responsible for processing the image, radar, and ultrasonic data, as well as displaying that data on the user interface, the data module is of critical importance to any semi- or fully autonomous vehicle. Henkel offers innovative solutions from structural bonding to package level protection materials.
Level 5 autonomous driving is the next frontier in ADAS advancement and V2X systems are the essential connectivity function that makes this possible.
V2X encompasses both V2V and V2I connectivity, two technologies that are crucial to the rise of Level 5 autonomous driving.
Henkel materials are integral to these devices, especially Thermal Interface Materials, underfills and encapsulants.
- Electronic control unit
Protect PCBs against harsh environmental conditions and chemicals while conserving weight and space.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe, and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Improve reliability with lead-free solder alternatives ideal for SMT components, thermal, structural bonding, and EMI applications.
Thermal interface materials, gaskets, and coatings with an electromagnetic absorption or shielding feature.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals, and extreme temperature variations.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today‘s challenging, high-density die architectures.
Modern vehicles rely on electronic control units, the heart of the vehicle. Control units must meet high automotive standards and are enabled by thermal materials, conductive pastes, film adhesives, encapsulants, coatings, sealants, and potting.
- Parking sensor
- Door handle
- Servo motor
- Wire harness
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals, and extreme temperature variations.
Provide tough, durable bonds to a wide variety of surfaces in engineering applications.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals, and extreme temperature variations.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals, and extreme temperature variations.
Typically, ultrasonic (parking) sensors are placed on the front and rear bumpers. Reliability and functionality depend on effective component integration and vehicle mounting, as well as thermal protection, Potting and encapsulation.
Designed to simplify the assembly processes for faster and more efficient protection of sensors, connectors, cables, and wire harness assemblies.
Door handle sensors in automotive electronics incorporate smart technology for keyless entry and enhanced security. Henkel adhesives optimize the performance of these sensors, ensuring a robust and enduring bond between the handles and electronic components. Crafted with precision, these adhesives contribute to a reliable and efficient automotive experience.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals, and extreme temperature variations.
Servo motors are pivotal in automotive electronics, providing precise control over essential functions like throttle, braking, and power steering, thereby enhancing overall vehicle performance and safety. The adhesive solutions further reinforces the reliability of servo motors by encapsulating and protecting sensitive electronic components, ensuring resilience against environmental factors and contributing to the longevity and durability of these critical systems.
Our potting systems and the fully automated application process for potting electronic housings and connector pins are perfectly matched with one another and adapted to your specific component requirements.
Our polyurethane potting for molding is characterized by excellent thermal insulation as well as high dielectric strength and heat resistance. There is also an optimal stiffness to-weight ratio. In addition, the molded parts are characterized by their excellent elasticity and abrasion resistance, even under continuous stress.
A wire harness routes wires and electricity for vehicle operation and must protect the wires from vibration, moisture, and abrasion while organizing the system for safe, optimized vehicle performance. Advanced materials provide reliable and highly efficient bonding, such as potting and low-pressure molding solutions.
- Center Information Display and Cluster panel
- Head Up Display
- Cockpit Domain control unit
Liquid optically clear adhesives (LOCA) are designed for optimized lamination processes in optical bonding, enabling optical components for improved contrast ratio, impact, heat, and moisture resistance.
Henkel can provide tough, durable bonds to a wide variety of surfaces in Automotive display applications and offers solutions for bonding of narrow borders in thin bond lines with the need of quick handling strength.
Henkel provides broad range of coating systems that enhance and protect product surfaces. Their properties span the range of surface energies, from hydrophobic to hydrophilic, oleophobic to oleophilic, and they provide protection against microbial growth, fingerprints, stains, and abrasion.
Next-generation cockpit displays are designed in rich, curved and large sizes and offer many types of important information in high resolution.
Henkel offers solutions such as optical bonding, structural bonding and thermal interface materials.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe, and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Achieve optical active alignment with advanced dual-cure / 1-step adhesives designed for reliable functionality.
Liquid optically clear adhesives (LOCA) are designed for optimized lamination processes in optical bonding, enabling optical components for improved contrast ratio, impact, heat, and moisture resistance.
Henkel can provide tough, durable bonds to a wide variety of surfaces in Automotive display applications and give solutions for bonding of narrow borders in thin bond lines with the need of quick handling strength.
HUD shows various information to the driver on the windscreen and the driver does not need to look down to the instrument cluster or the navigation screen. Latest HUD is fully connected with ADAS systems.
Henkel offers solutions such as optical bonding, structural bonding, active alignment adhesives and thermal interface materials.
Reliable bonding and sealing of enclosures with resistance to high temperatures, pressure, and vibrations. Broad range of form-in-place (FIPG) and cure-in-place liquid (CIPG) gasketing and plugging materials for liquid and gas-tight seams, joints, and flanges.
Provide superb resistance to mechanical shock, vibration, moisture, dust, chemicals, and extreme temperature variations.
Improve reliability with lead-free solder alternatives ideal for SMT components, thermal, structural bonding, and EMI applications.
Conductive and non-conductive adhesives with excellent dispensability and high-reliability performance are designed to meet today‘s challenging, high-density die architectures.
Protect PCBs against harsh environmental conditions and chemicals while conserving weight and space.
Henkel delivers high-performance thermal interface materials (TIM) enabling highly efficient, safe, and robust heat management. Effectively dissipating heat is critical to the reliability and longevity of automotive electronic components.
Protect solder joints from mechanical and thermal stresses and reinforce ball grid array components (BGA, CSP, Flip Chips) to ensure reliability in harsh environmental conditions.
The cockpit domain control unit acts as the central computing and communication hub for all cockpit functions, coordinating the exchange of information between multiple screens and in-cabin electrical systems. This advanced integration enhances both the user experience and driving safety.
- Brochure
- Case study
- Webinar
- White paper
Get in touch with our experts and start exploring advanced materials solutions today.
