LOCTITE® ABLESTIK 8290

Known as ABLEBOND 8290 (38G)

Features and Benefits

This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability lead frame packaging applications.
LOCTITE® ABLESTIK 8290 is a silver, electrically conductive die-attach adhesive for high-reliability leadframe packaging applications, recommended for die sizes up to 200 mils for the best MRT performance. It’s formulated with an epoxy-based resin, cures when exposed to heat and demonstrates low stress and low bleed.
  • Improved JEDEC performance
  • Low stress and low bleed
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 81.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 29.0 ppm
Extractable ionic content, Potassium (K+) 19.0 ppm
Extractable ionic content, Sodium (Na+) 19.0 ppm
RT die shear strength 15.0 kg-f
Tensile modulus, @ 250.0 °C 117.0 N/mm² (17000.0 psi )