LOCTITE® ABLESTIK 8290
Known as ABLEBOND 8290 (38G)
Features and Benefits
This silver, electrically-conductive die attach adhesive is specially designed for high reliability leadframe packaging applications.
LOCTITE® ABLESTIK 8290 electrically-conductive die attach adhesive is specifically designed for high reliability leadframe packaging applications. It is recommended for die sizes <200 mils for the best MRT performance, and is low stress and low bleed.
- Low stress
- Low bleed
- Improved JEDEC performance
Documents and Downloads
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Additional Documents
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 81.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 29.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| RT die shear strength | 15.0 kg-f |
| Tensile modulus, @ 250.0 °C | 117.0 N/mm² (17000.0 psi ) |
LOCTITE® ABLESTIK 8290
This silver, electrically-conductive die attach adhesive is specially designed for high reliability leadframe packaging applications.