BERGQUIST® GAP PAD® TGP 3000
Poznano kot Gap Pad® 3000S30
Lastnosti in prednosti
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Tehnične informacije
| Barva | Svetlo modra |
| Delovna temperatura | -60.0 - 200.0 °C |
| Dielektrična konstanta, ASTM D150 @ 1kHz | 7.0 |
| Gostota | 3.2 g/cm³ |
| Napetost dielektrične razgradnje | 3000.0 Vac |
| Ocena plamena | V-0 |
| Prostorninska upornost | 1×10 Ohm m |
| Standardna debelina | 0.254 - 3.175 mm |
| Toplotna zmogljivost, ASTM E1269 | 1.0 J/g-K |
| Trdota po Shoru, Thirty second delay value, ASTM D2240 Razsuta guma Shore 00 | 30.0 |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.