BERGQUIST® GAP PAD® TGP 3000
Poznat kao Gap Pad® 3000S30
Elementi i pogodnosti
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Tehnički podaci
| Boja | Svetlo plava |
| Dielektrična konstanta, ASTM D150 @ 1kHz | 7.0 |
| Dielektrični proboj napona | 3000.0 Vac |
| Gustina | 3.2 g/cm³ |
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.254 - 3.175 mm |
| Toplotni kapacitet, ASTM E1269 | 1.0 J/g-K |
| Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Guma u komadu Shore 00 | 30.0 |
| Zapreminska otpornost | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.