BERGQUIST® GAP PAD® TGP 3000
Tuntud kui Gap Pad® 3000S30
Omadused ja eelised
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Dielektriline konstant, ASTM D150 @ 1kHz | 7.0 |
| Dielektriline läbilöögipinge | 3000.0 Vac |
| Mahu resistiivsus | 1×10 Ohm m |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Puistkumm Shore 00 | 30.0 |
| Soojusmahtuvus, ASTM E1269 | 1.0 J/g-K |
| Standardpaksus | 0.254 - 3.175 mm |
| Tihedus | 3.2 g/cm³ |
| Töötemperatuur | -60.0 - 200.0 °C |
| Värvus | Helesinine |
BERGQUIST® GAP PAD® TGP 3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.