BERGQUIST® GAP FILLER TGF 1100SF
Poznano kot Gap Filler 1100SF
Lastnosti in prednosti
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
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Tehnične informacije
| Dielektrična konstanta, @ 1kHz | 5.0 |
| Gostota | 2.0 g/cm³ |
| Ocena plamena | V-0 |
| Prostorninska upornost | 1×10 Ohm m |
| Razmerje mešanice, glede na težo | 1 : 1 |
| Razmerje mešanja, glede na prostornino | 1 : 1 |
| Rok uporabnosti | 6.0 meseci |
| Temperatura skladiščenja | 25.0 °C |
| Toplotna prevodnost | 1.1 W/mK |
| Toplotna zmogljivost, ASTM E1269 | 0.9 J/g-K |
| Trdota po Shoru, Thirty second delay value, ASTM D2240 Shore 00 | 60.0 |
| Urnik strjevanja, Priporočeno @ 25.0 °C | 24.0 ure |
| Čas uporabnosti, @ 25.0 °C | 4.0 ure |
| Trdilec | |
| Barva, Trdilec | Rdeča |
| Smola | |
| Barva, Smola | Rumena |
BERGQUIST® GAP FILLER TGF 1100SF
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.