LOCTITE® ABLESTIK 561

Poznano kot ABLESTIK ABLEFILM 561

Lastnosti in prednosti

LOCTITE ABLESTIK 561, Epoxy Film, Assembly
LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.
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Tehnične informacije

Dielektrična konstanta, @ 1kHz 7.0
Fizična oblika Film
Način strjevanja Strjevanje na podlagi toplote
Strižna trdnost, Aluminij 1600.0 psi
Temperatura posteklenitve (Tg) 50.0 °C
Toplotna prevodnost 0.3 W/mK
Urnik strjevanja, @ 150.0 °C 30.0 min.