LOCTITE® ABLESTIK 561
Known as ABLESTIK ABLEFILM 561
Features and Benefits
LOCTITE ABLESTIK 561, Epoxy Film, Assembly
LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.
- Thermally conductive : 2.0 W/m-K
- Reworkable
- Flexible
Documents and Downloads
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Technical Information
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 7.0 |
| Glass transition temperature (Tg) | 50.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 1600.0 psi |
| Thermal conductivity | 0.3 W/mK |
LOCTITE® ABLESTIK 561
LOCTITE ABLESTIK 561, Epoxy Film, Assembly