LOCTITE® ABLESTIK 561
Poznat kao ABLESTIK ABLEFILM 561
Elementi i pogodnosti
LOCTITE ABLESTIK 561, Epoxy Film, Assembly
LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.
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Tehnički podaci
| Dielektrična konstanta, @ 1kHz | 7.0 |
| Fizički oblik | Folija |
| Raspored polimerizacije, @ 150.0 °C | 30.0 minuta |
| Sila smicanja, Aluminijum | 1600.0 psi |
| Temperatura razmekšavanja (Tg) | 50.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Toplotna provodljivost | 0.3 W/mK |
LOCTITE® ABLESTIK 561
LOCTITE ABLESTIK 561, Epoxy Film, Assembly