LOCTITE® ABLESTIK 2035SC-1B1
被称为 ABLEBOND 2035SC-1B1 (14G)
功能与优点
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for die attach applications requiring good dielectric layer. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK 2035SC-1B1 adhesive is the 20μm bondline control version of ABLEBOND 2035SC adhesive.
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技术信息
| RT 模剪切强度, 1.3 x 1.3 mm Si die on PBGA | 3.81 kg-f |
| 主要特性 | 传导性：不导电, 固化速度：快速固化, 应力：应力 |
| 固化方式 | 热+紫外线 |
| 外观形态 | 膏状 |
| 导热性 | 0.35 W/mK |
| 应用 | 芯片焊接 |
| 应用方法 | 加药装置 |
| 推荐与以下物料搭配使用 | 层压材料 |
| 热模剪切强度, @ 150.0 °C 1.3 x 1.3 mm Si die on PBGA | 1.11 kg-f |
| 热膨胀系数 (CTE) | 54.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 128.0 ppm/°C |
| 玻璃化温度 (Tg) | 120.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa.s (cP) |
| 组分数量 | 单组份 |
| 触变指数 | 4.3 |
| 颜色 | 红 |
LOCTITE® ABLESTIK 2035SC-1B1
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive