LOCTITE® ABLESTIK 2035SC-1B1
Known as ABLEBOND 2035SC-1B1 (14G)
Features and Benefits
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for die attach applications requiring good dielectric layer. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK 2035SC-1B1 adhesive is the 20μm bondline control version of ABLEBOND 2035SC adhesive.
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 54.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 128.0 ppm/°C |
| Color | Red |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 120.0 °C |
| Hot die shear strength, @ 150.0 °C 1.3 x 1.3 mm Si die on PBGA | 1.11 kg-f |
| Key characteristics | Conductivity: electrically non-conductive, Cure speed: fast cure, Stress: low stress |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 1.3 x 1.3 mm Si die on PBGA | 3.81 kg-f |
| Recommended for use with | Laminate |
| Thermal conductivity | 0.35 W/mK |
| Thixotropic index | 4.3 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2035SC-1B1
LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive